Epoch Microelectronics presented its first exhibition booth at Wireless Japan that was held at Tokyo Big Sight in July 2008. Since then, we have also participated in other exhibitions such as Microwave Workshops and Exhibition in Yokohama, Japan, Nov. 2008, Electronic Design and Solution Fair in Jan. 2009. GSA Expo and Conference in Oct. 2008, DesignCon in Feb. 2009. We will continue participating in future exhibitions and conferences related to the wireless communication and IC design. If you have opportunities to participate in those events, please visit our booth.

Wireless Technology Park (WTP)
May 13-14, 2010 @ Pacifico Yokohama, Japan

WTP started as the most efficient and effective exhibition which focuses on the latest technologies and R&D of wireless communications. Its goal is to build cooperative work and partnership between industry, academia and government in pursuit of tomorrow's business. WTP is sure to be an opportunity to enhance the information exchange for the latest wireless technology and new production and application concept with those cutting-edge technologies.
We will have our company presentation on 5/14 (Fri) 11:00-11:40 AM.

Internepcon Japan/ IC Packaging Technology Expo
January 20-22, 2010 @ Tokyo Big Sight, Japan

Internepcon is the Asia's Largest exhibition featuring all kinds of equipment, materials and technology for electronics manufacturing and SMT.
The IC packaging Technology Expo is one of 10 concurrent shows with Internepcon Japan such as Electrotest Japan, Printed Wiring Boards Expo, Automotive Electronics Technology Expo. It is the most powerful exhibition specialized in IC final manufacturing and packaging technology for sensors, MEMS devices, Opto Devices, etc.

Microwave Workshops and Exhibition 2009
November 25-27 @ Pacifico Japan in Yokohama

More than 400 microwave-related companies from all over the world will exhibit the latest products, such as High Frequency / Microwaves Systems, Subsystems, Components, Parts, Materials, Test instrument and related software. Various technical seminars are also available at the special seminar rooms.
Ken Suyama will take charge of the workshop “Challenges and Design Considerations for Integrated VCOs in Wireless Communications ” on November 26 (Thu) around 10:00 AM~.

DAC-Design Automation Conference
July 27-30, 2009 @ San Francisco Moscone Center, California, USA

The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

Wireless Japan 2009
July 22-24 @ Tokyo Big Sight, Japan

WIRELESS JAPAN 2009 will be the place to feel and realize the up-to-date mobile broadband technology in Japan. Other than those mobile broadband technologies, it will be also continue to features for the short-distance wireless technologies such as; ZigBee, Bluetooth, and UWB which many visitors looking for the update technology development. WIRELESS JAPAN is programmed more than 100 specialty sessions for conference and more than 130 exhibitors from worldwide. Our Sr.Design Engineer, Russell Mohn will take charge of the workshop “Modeling and Simulation of an All Digital Phase Locked Loop” on July 22(Wed)2:00PM~.

IMS-International Microwave Symposium
June 9-11, 2009 @ Boston Convention & Exhibition Center, Massachusetts, USA

IMS is the world's premier microwave conference. It features a large trade show and technical sessions, workshops and panel sessions, covering a wide range of topics regarding wireless communication, radar, RF technologies, high frequency semiconductors, electromagnetic, commercial and military RF, microwave and mm-wave electronics and applications.

Wireless Technology Park
May 12-13, 2009 @ Pacifico Yokohama, Kanagawa, Japan

Wireless Technology Park (WTP) started as the most efficient and effective exhibition which focuses on the latest technologies and R&D of wireless communications. Its goal is to build cooperative work and partnership between industry, academia and government in pursuit of tomorrow's business. WTP is sure to be an opportunity to enhance the information exchange for the latest wireless technology and new production and application concept with those cutting-edge technologies.

DesignCon
February 3-4, 2009 @ Santa Clara Convention Center, California, USA

DesignCon brings together the top vendors and industry leaders from the semiconductor and electronic design engineering communities to provide insight into the latest design techniques, tools, and products on the market today.

Electronic Design and Solution - EDSFair
January 22-23, 2009 @ Pacifico Yokohama, Kanagawa, Japan

EDSFair is one of the three largest trade shows in the world in the field of semiconductor and electronic system design, along with Design Automation Conference (DAC) and Design, Automation & Test in Europe (DATE). EDSFair specializes in advanced device technologies, such as EDA, ASICs (Application Specific Integrated Circuits), FPGA/PLDs (Field Programmable Gate Array/Programmable Logic Devices), IP re-usage, embedded software and design services. Also featured are the latest trends and targets for further development of electronics technologies.

In 2009, Epoch Microelectronics has presented papers to IEEE International Symposium on Circuits and Systems (ISCAS) and IEEE RFIC Symposium. The papers are:
ISCAS-“Audio pre-amplifiers for digital electret microphones in 0.18µm CMOS process
(Authors: Aleksander Dec, Hiroshi Akima, Russell Mohn, Ken Suyama)
RFIC-“A 5GHz LC VCO with extended linear-range varactor in purely design 0.15um CMOS Process
(Authors: Aleksander Dec, Hiroshi Akima, Ken Suyama)

Two papers were presented at IEEE International Symposium on Circuits and systems (ISCAS) in Taipei (May 24-27, 2009) and IEEE RFIC Symposium in Boston (June 7-9, 2009). Ken Suyama and Aleksander Dec attended both symposiums to present the papers.
RFIC was held at the same time with IMS at which we hosted an exhibit booth in their large-scale expo at the Boston Convention & Exhibition Center.

To receive a brochure and additional information, please send an email to us including your name, address and the nature of your interest. Thank you.